4JET microtech (www.4micro.de) has developed a high throughput solution that enables laser edge deletion, bus bar exposure and via drilling operations of CIGS glass substrates. Each of the new MPCT units can process 100 MW of typical CIGS substrates per annum, thereby reducing the number of backend processing stations when compared to conventional solutions. For typical large scale CIGS fabs with a nameplate capacity of 300 MW, up to now the 3 process steps would require at least 5 process lines with a total of up to 15 machines. The new MPCT system cuts down this number to only 3 units and provides for approximately 30% savings in CAPEX, 50% shorter ramp up times and a 30% smaller factory footprint.
The high precision laser edge deletion module allows to reduce panel edge dead zones enhancing module efficiencies. This is achieved by processing substrates on vacuum tables and smart image processing.
The bus bar exposure module is equipped with a quick exchange blade exchange system and process validation capabilities.
The glass drilling module enables free form shaping of vias including an edge chamfer for low-stress wire attachments.
4JET´s COO Oliver Albrich: “The recent breakthrough announcements for large volume CIGS deployment especially in China underline how promising the technology has become. 4JET has been partnering with CIGS players over the last decade. No one has done more work on backend processing of CIGS and we have continuously improved our product offering even when markets were down and other players left the arena. This puts us ahead now.”
